Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9299627 | Semiconductor package having a cap unit with concave portion and method of manufacturing the same | Toshihiko Nagano, Tadahiro Sasaki, Kazuhide Abe, Hiroshi Yamada, Kazuhiko Itaya | 2016-03-29 |