Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502367 | Semiconductor device including a cap facing a semiconductor chip and a bump electrode provided between the semiconductor chip and the cap | Hiroshi Yamada, Nobuto Managaki, Tadahiro Sasaki | 2016-11-22 |
| 9490237 | Semiconductor package including a plurality of chips | Hiroshi Yamada, Atsuko Iida, Kazuhiko Itaya | 2016-11-08 |
| 9397057 | Plurality of semiconductor devices in resin with a via | Hiroshi Yamada, Nobuto Managaki | 2016-07-19 |