Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502367 | Semiconductor device including a cap facing a semiconductor chip and a bump electrode provided between the semiconductor chip and the cap | Yutaka Onozuka, Hiroshi Yamada, Tadahiro Sasaki | 2016-11-22 |
| 9397057 | Plurality of semiconductor devices in resin with a via | Yutaka Onozuka, Hiroshi Yamada | 2016-07-19 |