Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9443744 | Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods | Sameer S. Vadhavkar, Xiao Li, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2016-09-13 |
| 9287240 | Stacked semiconductor die assemblies with thermal spacers and associated systems and methods | Jian Li, Michel Koopmans | 2016-03-15 |