Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9252172 | Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region | Seng Guan Chow, Rui Huang, Xusheng Bao, Ma Phoo Pwint Hlaing | 2016-02-02 |