Hang-Shing Ma — 2 Patents at Intel

Issued Patents 2016

Showing 1–2 of 2 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9530740	3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach	Kevin J. Lee, Mark Bohr, Andrew W. Yeoh, Christopher M. Pelto, Hiten Kothari +1 more	2016-12-27	$11,980,000
9449913	3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias	Kevin J. Lee, Mark Bohr, Andrew W. Yeoh, Christopher M. Pelto, Hiten Kothari +1 more	2016-09-20	$10,814,000