HM

Hiroyuki Miyazoe

IBM: 8 patents #494 of 10,295Top 5%
Applied Materials: 2 patents #221 of 946Top 25%
Globalfoundries: 2 patents #439 of 2,145Top 25%
📍 White Plains, NY: #11 of 136 inventorsTop 9%
🗺 New York: #240 of 11,723 inventorsTop 3%
Overall (2016): #5,588 of 481,213Top 2%
11
Patents 2016

Issued Patents 2016

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
9508801 Stacked graphene field-effect transistor Aaron D. Franklin, Satoshi Oida, Joshua T. Smith 2016-11-29
9493879 Selective sputtering for pattern transfer Mark Hoinkis, Eric A. Joseph 2016-11-15
9484220 Sputter etch processing for heavy metal patterning in integrated circuits Mark Hoinkis, Eric A. Joseph, Chun Yan 2016-11-01
9472499 Self-aligned pitch split for unidirectional metal wiring Josephine B. Chang, Michael A. Guillorn, Eric A. Joseph 2016-10-18
9437443 Low-temperature sidewall image transfer process using ALD metals, metal oxides and metal nitrides Markus Brink, Michael A. Guillorn, Sebastian U. Engelmann, Adam M. Pyzyna, Jeffrey W. Sleight 2016-09-06
9349640 Electrode pair fabrication using directed self assembly of diblock copolymers Josephine B. Chang, Michael A. Guillorn, Adam M. Pyzyna, HsinYu Tsai 2016-05-24
9337033 Dielectric tone inversion materials Martin Glodde, Wu-Song Huang, Ratnam Sooriyakumaran, HsinYu Tsai 2016-05-10
9318692 Self-limited crack etch to prevent device shorting Brian A. Bryce, Josephine B. Chang 2016-04-19
9306164 Electrode pair fabrication using directed self assembly of diblock copolymers Josephine B. Chang, Michael A. Guillorn, Adam M. Pyzyna, HsinYu Tsai 2016-04-05
9281212 Dielectric tone inversion materials Martin Glodde, Wu-Song Huang, Ratnam Sooriyakumaran, HsinYu Tsai 2016-03-08
9263393 Sputter and surface modification etch processing for metal patterning in integrated circuits Cyril Cabral, Jr., Benjamin L. Fletcher, Nicholas C. M. Fuller, Eric A. Joseph 2016-02-16