| 9493879 |
Selective sputtering for pattern transfer |
Mark Hoinkis, Hiroyuki Miyazoe |
2016-11-15 |
| 9484220 |
Sputter etch processing for heavy metal patterning in integrated circuits |
Mark Hoinkis, Hiroyuki Miyazoe, Chun Yan |
2016-11-01 |
| 9472499 |
Self-aligned pitch split for unidirectional metal wiring |
Josephine B. Chang, Michael A. Guillorn, Hiroyuki Miyazoe |
2016-10-18 |
| 9299638 |
Patterning transition metals in integrated circuits |
Cyril Cabral, Jr., Sebastian U. Engelmann, Benjamin L. Fletcher, Michael S. Gordon |
2016-03-29 |
| 9299639 |
Patterning transition metals in integrated circuits |
Cyril Cabral, Jr., Sebastian U. Engelmann, Benjamin L. Fletcher, Michael S. Gordon |
2016-03-29 |
| 9263393 |
Sputter and surface modification etch processing for metal patterning in integrated circuits |
Cyril Cabral, Jr., Benjamin L. Fletcher, Nicholas C. M. Fuller, Hiroyuki Miyazoe |
2016-02-16 |
