Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9524906 | Semiconductor device and manufacturing method thereof | Jong Sik Paek, Eun Sook Sohn, In Bae Park, Glenn Rinne | 2016-12-20 | $27,089,000 |
| 9437575 | Semiconductor device package formed in a chip-on-wafer last process using thin film adhesives | Michael Kelly, David Jon Hiner, Ji Hun Lee, Doo Hyun Park, Ronald Patrick Huemoeller | 2016-09-06 | $23,288,000 |
| 9431323 | Conductive pad on protruding through electrode | Yong Jae Ko | 2016-08-30 | $5,950,000 |
| 9391043 | Semiconductor device and manufacturing method thereof | Jong Sik Paek, Doo Hyun Park, Eun Ho Park, Sung Jae Oh | 2016-07-12 | $16,985,000 |
| 9362210 | Leadframe and semiconductor package made using the leadframe | Byung Hoon Ahn, Jae Hun Ku, Young Suk Chung, Suk Gu Ko, Sung Sik Jang +1 more | 2016-06-07 | $4,409,000 |
| 9349681 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Ronald Patrick Huemoeller, David Jon Hiner | 2016-05-24 | $5,703,000 |