Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9462704 | Extended landing pad substrate package structure and method | David Jon Hiner | 2016-10-04 |
| 9437575 | Semiconductor device package formed in a chip-on-wafer last process using thin film adhesives | Michael Kelly, David Jon Hiner, Ji Hun Lee, Won Chul Do, Doo Hyun Park | 2016-09-06 |
| 9406645 | Wafer level package and fabrication method | Sukianto Rusli, David Razu | 2016-08-02 |
| 9349681 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Won Chul Do, David Jon Hiner | 2016-05-24 |
| 9324614 | Through via nub reveal method and structure | Frederick Evans Reed, David Jon Hiner, Kiwook Lee | 2016-04-26 |
| 9230883 | Trace stacking structure and method | David Jon Hiner, Harry Donald McCaleb, III, Michael DeVita | 2016-01-05 |