Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502375 | Semiconductor device with plated pillars and leads | Jong Sik Paek, Seong Min Seo | 2016-11-22 |
| 9484331 | Semiconductor device and manufacturing method thereof | Jong Sik Paek | 2016-11-01 |
| 9478517 | Electronic device package structure and method of fabricating the same | Jong Sik Paek, Yoon Joo Kim, Seong Min Seo, Young Suk Chung | 2016-10-25 |
| 9437575 | Semiconductor device package formed in a chip-on-wafer last process using thin film adhesives | Michael Kelly, David Jon Hiner, Ji Hun Lee, Won Chul Do, Ronald Patrick Huemoeller | 2016-09-06 |
| 9418922 | Semiconductor device with reduced thickness | Jong Sik Paek | 2016-08-16 |
| 9406638 | Semiconductor device and manufacturing method thereof | Jong Sik Paek | 2016-08-02 |
| 9391043 | Semiconductor device and manufacturing method thereof | Jong Sik Paek, Won Chul Do, Eun Ho Park, Sung Jae Oh | 2016-07-12 |