Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437575 | Semiconductor device package formed in a chip-on-wafer last process using thin film adhesives | David Jon Hiner, Ji Hun Lee, Won Chul Do, Doo Hyun Park, Ronald Patrick Huemoeller | 2016-09-06 |
| 9433117 | Shield lid interconnect package and method | Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli | 2016-08-30 |
| 9349681 | Semiconductor device package and manufacturing method thereof | Ronald Patrick Huemoeller, Won Chul Do, David Jon Hiner | 2016-05-24 |