Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device package formed in a chip-on-wafer last process using thin film adhesives

Semiconductor device package formed in a chip-on-wafer last process using thin film adhesives

US Patent 9437575 · Granted Sep 6, 2016

Estimated economic value: $23,288,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Secure permissioning of access to user accounts, including secure deauthorizatio2025
Semiconductor device and manufacturing method thereof2025
Photonic glass layer substrate with embedded optical structures for communicatin2025
Semiconductor devices and methods of manufacturing semiconductor devices2025
Method for collective dishing of singulated dies2025
Semiconductor package with routing patch and method of fabricating the semicondu2025
Semiconductor package with routing patch and method of fabricating the semicondu2025
Semiconductor package with routing patch and method of fabricating the semicondu2025
Device chip scale package including a protective layer and method of manufacturi2025
Semiconductor device with redistribution layers formed utilizing dummy substrate2025
Multilayer electronic component2025
Semiconductor device using EMC wafer support system and fabricating method there2025