Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053873 | IC having voltage regulated integrated Faraday shield | Gregory E. Howard | 2011-11-08 |
| 8039309 | Systems and methods for post-circuitization assembly | Masood Murtuza, Donald C. Abbott | 2011-10-18 |
| 8017439 | Dual carrier for joining IC die or wafers to TSV wafers | Yoshimi Takahashi, Masood Murtuza, Rajiv Dunne | 2011-09-13 |
| 7973416 | Thru silicon enabled die stacking scheme | — | 2011-07-05 |
| 7915080 | Bonding IC die to TSV wafers | Yoshimi Takahashi, Masood Murtuza, Rajiv Dunne | 2011-03-29 |
| 7883936 | Multi layer low cost cavity substrate fabrication for PoP packages | Prema Palaniappan, Masood Murtuza | 2011-02-08 |