Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8044495 | Metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds | — | 2011-10-25 |
| 8039309 | Systems and methods for post-circuitization assembly | Masood Murtuza, Satyendra Singh Chauhan | 2011-10-18 |
| 8039317 | Aluminum leadframes for semiconductor QFN/SON devices | — | 2011-10-18 |
| 7939378 | Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication | Michael Mitchell, Paul R. Moehle, Douglas W. Romm | 2011-05-10 |
| 7928574 | Semiconductor package having buss-less substrate | — | 2011-04-19 |
| 7918018 | Method of fabricating a semiconductor device | Usman Mahmood Chaudhry | 2011-04-05 |
| 7872336 | Low cost lead-free preplated leadframe having improved adhesion and solderability | — | 2011-01-18 |
| 7863103 | Thermally improved semiconductor QFN/SON package | — | 2011-01-04 |