Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039309 | Systems and methods for post-circuitization assembly | Satyendra Singh Chauhan, Donald C. Abbott | 2011-10-18 |
| 8017439 | Dual carrier for joining IC die or wafers to TSV wafers | Yoshimi Takahashi, Rajiv Dunne, Satyendra Singh Chauhan | 2011-09-13 |
| 7915080 | Bonding IC die to TSV wafers | Yoshimi Takahashi, Rajiv Dunne, Satyendra Singh Chauhan | 2011-03-29 |
| 7883936 | Multi layer low cost cavity substrate fabrication for PoP packages | Prema Palaniappan, Satyendra Singh Chauhan | 2011-02-08 |