Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8017439 | Dual carrier for joining IC die or wafers to TSV wafers | Yoshimi Takahashi, Masood Murtuza, Satyendra Singh Chauhan | 2011-09-13 |
| 7915080 | Bonding IC die to TSV wafers | Yoshimi Takahashi, Masood Murtuza, Satyendra Singh Chauhan | 2011-03-29 |
| 7898069 | Stacked flip-assembled semiconductor chips embedded in thin hybrid substrate | — | 2011-03-01 |