Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8048358 | Pop semiconductor device manufacturing method | Kiyoharu Takano, Makoto Yoshino | 2011-11-01 |
| 8034660 | PoP precursor with interposer for top package bond pad pitch compensation | — | 2011-10-11 |
| 8017439 | Dual carrier for joining IC die or wafers to TSV wafers | Masood Murtuza, Rajiv Dunne, Satyendra Singh Chauhan | 2011-09-13 |
| 7971351 | Method of manufacturing a semiconductor device | Masazumi Amagai | 2011-07-05 |
| 7915080 | Bonding IC die to TSV wafers | Masood Murtuza, Rajiv Dunne, Satyendra Singh Chauhan | 2011-03-29 |