Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8048767 | Bonded wafer and method for producing bonded wafer | Akihiko Endo | 2011-11-01 |
| 8048769 | Method for producing bonded wafer | Akihiko Endo, Etsurou Morita | 2011-11-01 |
| 8003494 | Method for producing a bonded wafer | Hideki Nishihata, Tatsumi Kusaba, Akihiko Endo | 2011-08-23 |
| 7951692 | Method of producing semiconductor substrate having an SOI structure | Satoshi Murakami, Hideki Nishihata, Akihiko Endo | 2011-05-31 |
| 7927957 | Method for producing bonded silicon wafer | Tatsumi Kusaba, Akihiko Endo, Hideki Nishihata | 2011-04-19 |
| 7902043 | Method of producing bonded wafer | Akihiko Endo | 2011-03-08 |