Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8003494 | Method for producing a bonded wafer | Nobuyuki Morimoto, Tatsumi Kusaba, Akihiko Endo | 2011-08-23 |
| 7960225 | Method of controlling film thinning of semiconductor wafer for solid-state image sensing device | Etsurou Morita, Akihiko Endo, Yoshihisa Nonogaki | 2011-06-14 |
| 7951692 | Method of producing semiconductor substrate having an SOI structure | Satoshi Murakami, Nobuyuki Morimoto, Akihiko Endo | 2011-05-31 |
| 7927957 | Method for producing bonded silicon wafer | Tatsumi Kusaba, Akihiko Endo, Nobuyuki Morimoto | 2011-04-19 |