Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8003494 | Method for producing a bonded wafer | Hideki Nishihata, Nobuyuki Morimoto, Akihiko Endo | 2011-08-23 |
| 7939441 | P-type silicon wafer and method for heat-treating the same | Hidehiko Okuda | 2011-05-10 |
| 7927957 | Method for producing bonded silicon wafer | Akihiko Endo, Hideki Nishihata, Nobuyuki Morimoto | 2011-04-19 |
| 7927972 | Method for producing bonded wafer | Akihiko Endo | 2011-04-19 |