Issued Patents 2011
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8048769 | Method for producing bonded wafer | Nobuyuki Morimoto, Etsurou Morita | 2011-11-01 |
| 8048767 | Bonded wafer and method for producing bonded wafer | Nobuyuki Morimoto | 2011-11-01 |
| 8003494 | Method for producing a bonded wafer | Hideki Nishihata, Nobuyuki Morimoto, Tatsumi Kusaba | 2011-08-23 |
| 7960225 | Method of controlling film thinning of semiconductor wafer for solid-state image sensing device | Etsurou Morita, Yoshihisa Nonogaki, Hideki Nishihata | 2011-06-14 |
| 7951692 | Method of producing semiconductor substrate having an SOI structure | Satoshi Murakami, Nobuyuki Morimoto, Hideki Nishihata | 2011-05-31 |
| 7927972 | Method for producing bonded wafer | Tatsumi Kusaba | 2011-04-19 |
| 7927957 | Method for producing bonded silicon wafer | Tatsumi Kusaba, Hideki Nishihata, Nobuyuki Morimoto | 2011-04-19 |
| 7902043 | Method of producing bonded wafer | Nobuyuki Morimoto | 2011-03-08 |
| 7867877 | Method for manufacturing SOI wafer | Etsuro Morita | 2011-01-11 |