Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8048769 | Method for producing bonded wafer | Nobuyuki Morimoto, Akihiko Endo | 2011-11-01 |
| 7960225 | Method of controlling film thinning of semiconductor wafer for solid-state image sensing device | Akihiko Endo, Yoshihisa Nonogaki, Hideki Nishihata | 2011-06-14 |
| 7951716 | Wafer and method of producing the same | Kazuo Hujie, Isoroku Ono | 2011-05-31 |