Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030757 | Forming a semiconductor package including a thermal interface material | Mukul Renavikar, Carl Deppisch, Abhishek Gupta | 2011-10-04 |
| 8018063 | Solder joint reliability in microelectronic packaging | Stephen Lehman, Mukul Renavikar | 2011-09-13 |
| 7986209 | Inductor using bulk metallic glass material | Chang-Min Park | 2011-07-26 |
| 7983020 | Carbon nanotube coated capacitor electrodes | Yongki Min | 2011-07-19 |
| 7947134 | Process for joining materials using bulk metallic glasses | Boonrat Lohwongwatana, Robert D. Conner, Jin-Yoo SUH, William L. Johnson | 2011-05-24 |
| 7867818 | Methods and apparatuses for providing stacked-die devices | Debendra Mallik | 2011-01-11 |