Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8018063 | Solder joint reliability in microelectronic packaging | Daewoong Suh, Mukul Renavikar | 2011-09-13 |
| 8009442 | Directing the flow of underfill materials using magnetic particles | Rahul N. Manepalli, Leonel Arana, Wendy Chan | 2011-08-30 |