Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030757 | Forming a semiconductor package including a thermal interface material | Daewoong Suh, Carl Deppisch, Abhishek Gupta | 2011-10-04 |
| 8018063 | Solder joint reliability in microelectronic packaging | Daewoong Suh, Stephen Lehman | 2011-09-13 |