Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030757 | Forming a semiconductor package including a thermal interface material | Mukul Renavikar, Daewoong Suh, Abhishek Gupta | 2011-10-04 |
| 7955900 | Coated thermal interface in integrated circuit die | Susheel Jadhav | 2011-06-07 |