Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7932596 | Thermally enhanced electronic flip-chip packaging with external-connector-side die and method | Robert L. Sankman | 2011-04-26 |
| 7867818 | Methods and apparatuses for providing stacked-die devices | Daewoong Suh | 2011-01-11 |