Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7932596 | Thermally enhanced electronic flip-chip packaging with external-connector-side die and method | Debendra Mallik | 2011-04-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7932596 | Thermally enhanced electronic flip-chip packaging with external-connector-side die and method | Debendra Mallik | 2011-04-26 |