Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039937 | Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same | Hyun-Soo Chung, Seung-Kwan Ryu, Dong-Ho Lee, Seong-Deok Hwang | 2011-10-18 |
| 7897511 | Wafer-level stack package and method of fabricating the same | In-Young Lee, Ho-Jin Lee, Hyun-Soo Chung, Son-Kwan Hwang | 2011-03-01 |
| 7875552 | Methods of forming integrated circuit chips having vertically extended through-substrate vias therein and chips formed thereby | Ho-Jin Lee, Kang-Wook Lee, Myeong-Soon Park, Son-Kwan Hwang | 2011-01-25 |