Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039937 | Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same | Hyun-Soo Chung, Seung-Kwan Ryu, Ju-Il Choi, Dong-Ho Lee | 2011-10-18 |
| 7969024 | Semiconductor package with joint reliability, entangled wires including insulating material | Hyun-Soo Chung, Jae-Shin Cho, Jum-Gon Kim, Ki Hyuk Kim | 2011-06-28 |