Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039937 | Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same | Seung-Kwan Ryu, Ju-Il Choi, Dong-Ho Lee, Seong-Deok Hwang | 2011-10-18 |
| 7969024 | Semiconductor package with joint reliability, entangled wires including insulating material | Jae-Shin Cho, Seong-Deok Hwang, Jum-Gon Kim, Ki Hyuk Kim | 2011-06-28 |
| 7948089 | Chip stack package and method of fabricating the same | Dong-Ho Lee, Nam-Seog Kim, Son-Kwan Hwang | 2011-05-24 |
| 7923296 | Board on chip package and method of manufacturing the same | Dong-Hyeon Jang, Dong-Ho Lee, In-Young Lee | 2011-04-12 |
| 7897511 | Wafer-level stack package and method of fabricating the same | In-Young Lee, Ho-Jin Lee, Ju-Il Choi, Son-Kwan Hwang | 2011-03-01 |