Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7948089 | Chip stack package and method of fabricating the same | Hyun-Soo Chung, Dong-Ho Lee, Nam-Seog Kim | 2011-05-24 |
| 7897511 | Wafer-level stack package and method of fabricating the same | In-Young Lee, Ho-Jin Lee, Hyun-Soo Chung, Ju-Il Choi | 2011-03-01 |
| 7875552 | Methods of forming integrated circuit chips having vertically extended through-substrate vias therein and chips formed thereby | Ho-Jin Lee, Kang-Wook Lee, Myeong-Soon Park, Ju-Il Choi | 2011-01-25 |