Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7875552 | Methods of forming integrated circuit chips having vertically extended through-substrate vias therein and chips formed thereby | Ho-Jin Lee, Kang-Wook Lee, Ju-Il Choi, Son-Kwan Hwang | 2011-01-25 |