Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7969024 | Semiconductor package with joint reliability, entangled wires including insulating material | Hyun-Soo Chung, Jae-Shin Cho, Seong-Deok Hwang, Ki Hyuk Kim | 2011-06-28 |
JK
Jum-Gon Kim
Overall (2011): #254,424 of 364,097Top 70%
1
Patents 2011