Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8044475 | Chip package | Mou-Shiung Lin, Hsin-Jung Lo | 2011-10-25 |
| 8021921 | Method of joining chips utilizing copper pillar | Mou-Shiung Lin | 2011-09-20 |
| 7973401 | Stacked chip package with redistribution lines | Mou-Shiung Lin, Hsin-Jung Lo, Ying-Chih Chen, Chiu-Ming Chou | 2011-07-05 |
| 7960270 | Method for fabricating circuit component | Jin-Yuan Lee, Chien-Kang Chou, Hsi-Shan Kuo | 2011-06-14 |
| 7960272 | Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging | Jin-Yuan Lee | 2011-06-14 |