Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026588 | Method of wire bonding over active area of a semiconductor circuit | Jin-Yuan Lee, Mou-Shiung Lin | 2011-09-27 |
| 8021976 | Method of wire bonding over active area of a semiconductor circuit | Jin-Yuan Lee | 2011-09-20 |
| 7973401 | Stacked chip package with redistribution lines | Mou-Shiung Lin, Shih-Hsiung Lin, Hsin-Jung Lo, Chiu-Ming Chou | 2011-07-05 |
| 7919412 | Over-passivation process of forming polymer layer over IC chip | Mou-Shiung Lin, Chiu-Ming Chou | 2011-04-05 |