Issued Patents 2011
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8044475 | Chip package | Mou-Shiung Lin, Shih-Hsiung Lin | 2011-10-25 |
| 8004092 | Semiconductor chip with post-passivation scheme formed over passivation layer | Mou-Shiung Lin, Chien-Kang Chou, Chiu-Ming Chou, Ching-San Lin | 2011-08-23 |
| 7990037 | Carbon nanotube circuit component structure | Mou-Shiung Lin, Chien-Kang Chou | 2011-08-02 |
| 7973401 | Stacked chip package with redistribution lines | Mou-Shiung Lin, Shih-Hsiung Lin, Ying-Chih Chen, Chiu-Ming Chou | 2011-07-05 |
| 7964973 | Chip structure | Mou-Shiung Lin, Chiu-Ming Chou, Chien-Kang Chou | 2011-06-21 |
| 7964961 | Chip package | Jin-Yuan Lee | 2011-06-21 |
| 7960269 | Method for forming a double embossing structure | Mou-Shiung Lin, Chiu-Ming Chou, Chien-Kang Chou | 2011-06-14 |
| 7947978 | Semiconductor chip with bond area | Mou-Shiung Lin, Huei-Mei Yen, Chiu-Ming Chou, Ke-Hung Chen | 2011-05-24 |
| 7932172 | Semiconductor chip and process for forming the same | Mou-Shiung Lin, Chien-Kang Chou | 2011-04-26 |