Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8062977 | Ternary tungsten-containing resistive thin films | Kaihan Ashtiani, Raashina Humayun, Anna Battaglia, Stefano Rassiga | 2011-11-22 |
| 8017523 | Deposition of doped copper seed layers having improved reliability | Hui-Jung Wu, Daniel R. Juliano, Wen Wu | 2011-09-13 |