Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8017523 | Deposition of doped copper seed layers having improved reliability | Hui-Jung Wu, Daniel R. Juliano, Girish Dixit | 2011-09-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8017523 | Deposition of doped copper seed layers having improved reliability | Hui-Jung Wu, Daniel R. Juliano, Girish Dixit | 2011-09-13 |