Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7998857 | Integrated circuit and process for fabricating thereof | Islam A. Salama, Houssam Jomaa, Ravi Tanikella | 2011-08-16 |
| 7985622 | Method of forming collapse chip connection bumps on a semiconductor substrate | Ravi Kiran Nalla, Islam A. Salama, Hamid Azimi | 2011-07-26 |
| 7956713 | Forming a helical inductor | Arun Chandrasekhar, Srikrishnan Venkataraman, Priyavadan R. Patel, Shamala Chickamenahalli, Robert J. Fite | 2011-06-07 |
| 7915060 | Grid array connection device and method | Munehiro Toyama, Siew Fong Tai, Kian Sin Sim, Selvy Tamil Selvamuniandy | 2011-03-29 |
| 7888784 | Substrate package with through holes for high speed I/O flex cable | Sanka Ganesan, Chandrashekhar Ramaswamy, Mark S. Hlad | 2011-02-15 |