Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7888784 | Substrate package with through holes for high speed I/O flex cable | Charan Gurumurthy, Sanka Ganesan, Mark S. Hlad | 2011-02-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7888784 | Substrate package with through holes for high speed I/O flex cable | Charan Gurumurthy, Sanka Ganesan, Mark S. Hlad | 2011-02-15 |