Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7919408 | Methods for fabricating fine line/space (FLS) routing in high density interconnect (HDI) substrates | Sheng Li | 2011-04-05 |
| 7888784 | Substrate package with through holes for high speed I/O flex cable | Charan Gurumurthy, Sanka Ganesan, Chandrashekhar Ramaswamy | 2011-02-15 |