Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8035218 | Microelectronic package and method of manufacturing same | John S. Guzek, Mahadevan Survakumar | 2011-10-11 |
| 7985622 | Method of forming collapse chip connection bumps on a semiconductor substrate | Ravi Kiran Nalla, Islam A. Salama, Charan Gurumurthy | 2011-07-26 |