Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7985622 | Method of forming collapse chip connection bumps on a semiconductor substrate | Islam A. Salama, Charan Gurumurthy, Hamid Azimi | 2011-07-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7985622 | Method of forming collapse chip connection bumps on a semiconductor substrate | Islam A. Salama, Charan Gurumurthy, Hamid Azimi | 2011-07-26 |