Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8050037 | Electronic control device using LC module structure | Nobutake Tsuyuno, Hideto Yoshinari, Masahiko Asano, Masahide Harada, Shinya Kawakita | 2011-11-01 |
| 7964975 | Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them | Ryoichi Kajiwara, Shigehisa Motowaki, Kazutoshi Itou | 2011-06-21 |
| 7955411 | Low temperature bonding material comprising metal particles and bonding method | Yusuke Yasuda, Toshiaki Morita, Eiichi Ide, Toshiaki Ishii | 2011-06-07 |