Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7985991 | MOSFET package | Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii +5 more | 2011-07-26 |
| 7964975 | Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them | Shigehisa Motowaki, Kazutoshi Itou, Hiroshi Hozoji | 2011-06-21 |
| 7879455 | High-temperature solder, high-temperature solder paste and power semiconductor using same | Kazutoshi Itou | 2011-02-01 |