Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8008772 | Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereof | Yusuke Yasuda, Eiichi Ide | 2011-08-30 |
| 7985991 | MOSFET package | Ryoichi Kajiwara, Masahiro Koizumi, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii +5 more | 2011-07-26 |
| 7955411 | Low temperature bonding material comprising metal particles and bonding method | Yusuke Yasuda, Eiichi Ide, Hiroshi Hozoji, Toshiaki Ishii | 2011-06-07 |