Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7955411 | Low temperature bonding material comprising metal particles and bonding method | Yusuke Yasuda, Toshiaki Morita, Eiichi Ide, Hiroshi Hozoji | 2011-06-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7955411 | Low temperature bonding material comprising metal particles and bonding method | Yusuke Yasuda, Toshiaki Morita, Eiichi Ide, Hiroshi Hozoji | 2011-06-07 |