Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7964975 | Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them | Ryoichi Kajiwara, Shigehisa Motowaki, Hiroshi Hozoji | 2011-06-21 |
| 7879455 | High-temperature solder, high-temperature solder paste and power semiconductor using same | Ryoichi Kajiwara | 2011-02-01 |